BACPAC

Inputs to BACPAC

• Number of routing layers
• Pitches
• Resistivity of the wires
• Dielectric constant of the insulators between the layers

• V_dd, also called supply voltage
• V_t, also called threshold voltage
• Gate oxide thickness of the MOS transistors
• Drain current
• Fan-in

• Block design size
• Silicon efficiency
• logic depth
• Rent’s exponent

  BACPAC outputs

• Chip area
• Maximum clock frequency - how fast the chip can run
• Optimized device sizes - estimated devices sizes to make it run this fast
• Interconnect RC
• Average wirelength
• Ratio of wire delay to gate delay

• Clock frequency with noise
• Newly optimized device sizes for the clock distribution network
• Ratio of wire delay to gate delay

• Wiring capacity
• Wiring requirements,
• Wiring needs for clock distribution
• Wiring needs for the power distribution network

• Total power consumption, divided into sub-categories:
• *Clock
• *I/O
• *memory
• *global wiring
• *logic
• *short-circuit
• *leakage

• Projected yields for excellent, average, and poor process control using a negative binomial yield mode